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EPoSS - The Product Driven Platform

Production Capabilities

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Fabrication of sensors
Description Picture
 Current Use
III-V Device fabrication facility
Fabrication of sensors

 Development of sensors in range of application areas
MRL RTO
 Contact
9/10
 Tyndall National Institute, University College Cork, Ireland (www.tyndall.ie)
 Dr Eric Moore eric.moore@tyndall.ie


Atomic layer deposition (ALD) passivation
Description Picture
 Current Use
- Precise deposition of materials in layers of atomic thickness.
- High conformal factor that can be useful for complex geometries

 ALD passivation
 Electronics industry, solar energy, medical devices and packaging
MRL RTO
 Contact
9/10
 Tyndall National Institute, University College Cork, Ireland (www.tyndall.ie)
 Dr Eric Moore eric.moore@tyndall.ie


High temperature packages
Description Picture
 Current Use
Fabrication of ceramic packages for extreme temperatures (> 500°C)
High temperature packages

 In research project demonstrations
MRL RTO
 Contact
4
 Swerea IVF AB, Mölndal, Sweden (www.swereaivf.se)
 Klas Brinkfeldt klas.brinkfeldt@swerea.se


High temperature interconnects
Description Picture
 Current Use
Sintered silver interconnects for temperatures up to 600°C
High temperature interconnects

 In research project demonstrations and process optimization
MRL RTO
 Contact
4
 Swerea IVF AB, Mölndal, Sweden (www.swereaivf.se)
 Klas Brinkfeldt klas.brinkfeldt@swerea.se


Printed circuit board assembly
Description Picture
 Current Use
Lead free and leaded production
Printed circuit board assembly

 Prototype manufacturing/process optimization
MRL RTO
 Contact
4 and 10
 Swerea IVF AB, Mölndal, Sweden (www.swereaivf.se)
 Per-Erik Tegehall, per-erik.tegehall@swerea.se


Flexible fully automatic AVT mounting center
Description Picture
 Current Applications
The modular system concept allows the implementation of most important AVT-assembly steps in one device. Special functions like laser soldering, dispenser for solder paste or -jetting, pick & place of fragile components, high-precision and very fast accurate positioning of UV-LEDs, innovative joining processes such as Thermosonic bonding can be realized with this platform
Automatic AVT mounting center

Automatic AVT mounting center

 Assembly of LED modules, especially flip chip bonded UV LEDs, in different designs and sizes
TRL RTO
 Contact
4 for UV LEDs , 6 for VIS
 CiS Forschungsinstitut für Mikrosensorik GmbH (www.cismst.de) Dr. Olaf Brodersen
obrodersen@cismst.de

Fabrication of micromechanical and optical silicon sensors
Description Picture
 Current Use
Fabrication facility for
  • piezoresistive sensor chips,
  • photodetectors,
  • photodetector arrays, and
  • radiation detectors
Fabrication of micromechanical and optical silicon sensors

Silicon wafer processing

 Industry automation, precision measurement and basic physic research as well as harsh environment applications
MRL RTO
 Contact
8
 CiS Forschungsinstitut für Mikrosensorik GmbH (www.cismst.de)
 Dr. Thomas Ortlepp tortlepp@cismst.de


Fabrication of microfluidic disposables
Description Picture
 Current Use
  • Throughput of up to 200,000 test carriers annually
  • Clean room ISO 7
  • Forming, filling and sealing of test carriers
Fabrication of microfluidic disposables

 Mainly for centrifugal microfluidic test carriers, e.g. LabDisks, but potentially other disposables as well
MRL RTO
 Contact
7
 Hahn-Schickard Freiburg, Germany www.Hahn-Schickard.de
 Dr Daniel Mark Daniel.Mark@Hahn-Schickard.de


Fabrication of Molded Interconnected Devices (MID)
Description Picture
 Current Use
Pilot line for MID fabrication
Fabrication of Molded Interconnected Devices (MID)

MID on work piece carrier

 Sensor devices for medical technology application
MRL RTO
 Contact
8
 Hahn-Schickard, Stuttgart, Germany www.hahn-schickard.de Dr. Ulrich Kessler Ulrich.Kessler@Hahn-Schickard.de


Fabrication of micro systems
Description Picture
 Current Use
Facilities for
  • injection molding,
  • metal plating,
  • laser processing,
  • printing, and
  • advanced micro assembly
Fabrication of micro systems

3D Assembly cluster

 Actuator and sensor systems
MRL RTO
 Contact
8
 Hahn-Schickard, Stuttgart, Germany www.hahn-schickard.de Dr. Ulrich Kessler Ulrich.Kessler@Hahn-Schickard.de


MRL:Manufacturing Readiness Level

 

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