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Electrochemical Sensing Array Devices

Description Picture
 Current Applications
3x3 electrode array, integrated with 3 electrodes, WE (gold) RE (Ag/AgCl) and Counter (Pt)
Electrochemical Sensing Array Devices

Electrochemical Sensing Array

 Biosensor and Chemical Sensors for research and development
TRL RTO
 Contact
6
 Tyndall National Institute, University College Cork, Ireland (www.tyndall.ie)
 Dr Eric Moore eric.moore@tyndall.ie


High-precision temperature sensor devices

Description Picture
 Current Applications
Silicon integrated sensor
High precision P-well diode with four-wire measurement option;
Suitable for customer specific preprocessing and for single-point calibration and calibration-free temperature measurement in the range from 4K to 500K
Temperature sensor devices

High precision P-well diode with four-wire measurement

 Condensation sensor, impedance sensor, opto-electrical sensor
TRL RTO
 Contact
4
 CiS Forschungsinstitut für Mikrosensorik GmbH (www.cismst.de) Dr. Klaus Ettrich
kettrich@cismst.de


Interdigital electrode array on Si
Description Picture
 Current Applications
Silicon Chip with an electrical strayfield and a temperature diode
Interdigital electrodes

Interdigital electrodes

 Micro condensation sensor for monitoring environment of electronic hardware
TRL RTO
 Contact
8
 CiS Forschungsinstitut für Mikrosensorik GmbH (www.cismst.de) Dr. Klaus Ettrich
kettrich@cismst.de

Silicon strain gauges
Description Picture
 Current Applications
Thinned silicon strain gauge, Joining to LTCC, steel, titanium, aluminium by glass sealing
Silicon strain gauge

Silicon strain gauge

 Pressure transducer, absolute and differential for applications in  Automation, Pneumatic, Medical technologies,
Force and torque
TRL RTO
 Contact
8 for strain gauge,
7 for HT sealing
 CiS Forschungsinstitut für Mikrosensorik GmbH (www.cismst.de) Dr. Klaus Ettrich
kettrich@cismst.de

Lock-in amplifier
Description Picture
 Current Applications
Near-to-sensor electronics
comprising of a microcontroller, a source delivering a sinusoidal current to the LEDs, one of 3 LED chips addressable, and a lock-in demodulator for retrieving the photocurrent signal
Scheme of the near-to-sensor electronics

Scheme of the near-to-sensor electronics

 Small signal processing,
Fluorescence sensing in general
TRL RTO
 Contact
5
 CiS Forschungsinstitut für Mikrosensorik GmbH (www.cismst.de) Dr. Olaf Brodersen
obrodersen@cismst.de

Optical reader
Description Picture
 Current Applications
LED lighting array with 300 µm spots for fluorescence applications. The carrier is a photodiode array, which monitors the light intensity of each LED. The light is guided by means of a micro lens array and an optical filter in spectrally defined, parallel rays
2 x 2 LED lighting array

2 x 2 LED lighting array

 Multi-Channel Sensors for Nanoliter Analytics
TRL RTO
 Contact
4
 CiS Forschungsinstitut für Mikrosensorik GmbH (www.cismst.de) Dr. Olaf Brodersen
obrodersen@cismst.de

3D photodetector array
Description Picture
 Current Applications
Segmented photodiode with active areas within the inclined surfaces of a deep etched cavity.
This wafer level approach allows strong miniaturization and low tolerances
3D Si Photodiode array

3D Si Photodiode array

 Micro Sensor for Detecting the Direction of Incoming Light in the VIS-NIR range
TRL RTO
 Contact
4
 CiS Forschungsinstitut für Mikrosensorik GmbH (www.cismst.de) Dr. Olaf Brodersen
obrodersen@cismst.de

UV LED unit, stabilised
Description Picture
 Current Applications
Micro-optical system for focussing light of 3 UV LEDs and
Microoptical system with short-pulsed UV-LED
Scheme of a micro-optical system for a short pulse UV LED array

Scheme of a micro-optical system for a short pulse UV LED array

 Tumor diagnosis, Bioanalytics, DNA analytics
TRL RTO
 Contact
6
 CiS Forschungsinstitut für Mikrosensorik GmbH (www.cismst.de) Dr. Olaf Brodersen
obrodersen@cismst.de


3D silicon microstructure modules
Description Picture
 Current Applications
Interposer,
Cavities, domes, pyramids, holes,
Lowered bond pads, Metallization in different levels,
3D interdigital electrode structures,
Voltammetric and impedance multi sensors
3D silicon microstructure modules

 Level sensors,
Vital parameter for health application,
Condensation sensors for environmental application,
Bio- and chemical sensors for research and development
TRL RTO
 Contact
5
 CiS Forschungsinstitut für Mikrosensorik GmbH (www.cismst.de) Dr. Olaf Brodersen
obrodersen@cismst.de


Piezoresistive sensors
Description Picture
 Current Applications
Etched Cantilevers, membranes
Wheatstone bridges
Piezoresistive sensors

Wheatstone bridge on membrane

 Pressure sensors in industry automation, Strain gauges and Force sensors
TRL RTO
 Contact
5
 CiS Forschungsinstitut für Mikrosensorik GmbH (www.cismst.de) Dr. Klaus Ettrich
kettrich@cismst.de


Optical bidirectional sensors (MORES®)
Description Picture
 Current Applications
Silicon module with embedded light emitter dies, surrounding photodetector array, thinfilm filters, light beam shaping element
Optical bidirectional sensors

Micro-optical remission sensor

 Medical sensors for measuring vital parameters;
Refraction sensors;
Gas sensors, like CO2
TRL RTO
 Contact
6
 CiS Forschungsinstitut für Mikrosensorik GmbH (www.cismst.de) Dr. Olaf Brodersen
obrodersen@cismst.de


Fluidic Module
Description Picture
 Current Applications
The module includes 3 fluidic manifols that were specifically designed for microfluidic / biological applications.
Fluidic module

 Food safety or veterinary diagnostics
TRL RTO
 Contact
7
 IK4-IKERLAN (www.ikerlan.es)                                         
 Kepa Mayora
kmayora@ikerlan.es


Low cost Disposable cartridge
Description Picture
 Current Applications
The cartrige is manufactured by injection moulding and can be manufactured thousands units per year.
Low cost disposable cartridge

 Microfluidic applications: food allergens
TRL RTO
 Contact
8
 IK4-IKERLAN (www.ikerlan.es)                                         
 Kepa Mayora
kmayora@ikerlan.es

Autonomous Sensor Systems for harsh environment
Description Picture
 Current Applications
The sensors are based on commercial transducers (temperature, distance, strain) and the packaging is specifically designed for the application. Electronics are designed for very low power applications, including smart wake-up concepts and energy aware components. They include low power communication capability.
Autonomous sensor system harsh environment 1

autonomous sensor system harsh environment 2

 Monitoring mechanical structures for predictive maintenance
TRL RTO
 Contact
8
 IK4-IKERLAN (www.ikerlan.es)                                         
 Kepa Mayora
kmayora@ikerlan.es


Energy Management Module for Energy Harvesters
Description Picture
 Current Applications
This low-power module aids integration of Energy Harvesters (EH) into real applications by providing an interface between the EH and the system to be powered. The module enables storage and best use of the energy produced by EHs.
Energy Management Module for Energy Harvesters

 Smart Systems Integration
TRL RTO
 Contact
5
 IK4-IKERLAN (www.ikerlan.es)                                         
 Iosu Gabilondo
igabilondo@ikerlan.es

Surface monitoring sensor
Description Picture
 Current Applications
This sensor module provides information about irregularities in metallic surfaces. The device works in close proximity, providing measurements related to surface quality.
The device features an array of coils that detect, by means of Eddy currents, cracks in metallic surfaces in the sub millimeter range(up to 0.05 mm depth)
Surface monitoring sensor

Surface quality of manufactured components
TRL RTO
 Contact
5
 IK4-IKERLAN (www.ikerlan.es)                                          Iosu Gabilondo
igabilondo@ikerlan.es


Synchonised modular nodes for customization of Wireless Sensor Networks
Description Picture
 Current Applications
This module consists of a generic node architecture, compatible with any sensor type, for the generation of Wireless Network solutions. Each node is arranged in layers, whereby each layer contains a sub-system (sensor, powering, communications etc.) allowing faster prototyping of the customized system. Robust wireless provides reliable communications across the Network, even in complex environments.
Modular node for customization of Wireless Sensor Networks

 Monitoring of structures
TRL RTO
 Contact
5
 IK4-IKERLAN (www.ikerlan.es)                                         
 Iosu Gabilondo
igabilondo@ikerlan.es


Dynamic heating/cooling module
Description Picture
 Current Applications
This module consists of a low inertia and flat thermal element that can be heated and cooled fast and accurately to a given temperature. The footprint of the heating area being only 1cm², and it is fabricated on flexible electronics, making it simple to integrate into a larger system. Peak consumption is 2W, maintenance power is 1W. The solution can be scaled to larger areas.
Dynamic heating/cooling module

 Thermocycling in microfluidic devices
TRL RTO
 Contact
6
 IK4-IKERLAN (www.ikerlan.es)                                         
 Kepa Mayora kmayora@ikerlan.es


Microfluidic cartridge
Description Picture
 Current Applications
Chip units designed for fast prototyping of plastic microfluidic cartridge, previous to injection and laminar fabrication technology
Microfluidic cartridge

 Lab on a chip and chemical reactions
TRL RTO
 Contact
6
 IK4-IKERLAN (www.ikerlan.es)                                         
 Kepa Mayora kmayora@ikerlan.es


Wireless powered solutions
Description Picture
 Current Applications
Wireless power transfer based solutions for powering non wired links and devices
Wireless powered solutions

 Wireless Power
TRL RTO
 Contact
5
 IK4-IKERLAN (www.ikerlan.es)                                         
 Iosu Gabilondo
igabilondo@ikerlan.es

Centrifugal microfluidics (“LabDisk”)
Description Picture
 Current Applications
Point-of-Care diagnostics:
  • full automation
  • low to medium throughput,
  • portable device
  • low-cost disposable
Centrifugal microfluidics

 DNA/RNA applications:
  • Sepsis diagnostics
  • Respiratory pathogens
  • Differential fever diagnostics
Immunoassays
Enzymatic assays
TRL RTO
 Contact
6
 Hahn-Schickard Freiburg, Germany www.Hahn-Schickard.de
 Dr Daniel Mark Daniel.Mark@Hahn-Schickard.de


Plating on Plastics
Description Picture
 Current Applications
  • processes for electroless plating (Cu/Ni/Au; Cu/Ag, Cu/Pd/Au; Cu/Sn) on thermoplastic, thermoset and ceramic materials
  • electroplating
Plating on Plastics

Metal line thermoset

 -Molded Interconnect Devices (MID)
-micro systems for different branches
TRL RTO
 Contact
7
 Hahn-Schickard, Stuttgart,Germany
www.hahn-schickard.de
 Dr. Wolfgang Eberhardt
Wolfgang.Eberhardt@Hahn-Schickard.de


Physical vapour deposition
Description Picture
 Current Applications
  • starting layers for electroless plating and electroplating
  • optical reflective layers
Optical encoder disc

Optical encoder discs

 -Molded Interconnect Devices (MID)
-optical encoder disks
-micro systems for different branches
TRL RTO
 Contact
7
 Hahn-Schickard, Stuttgart,Germany www.hahn-schickard.de
 Hagen Mueller Hagen.Mueller@Hahn-Schickard.de


Laser processing
Description Picture
 Current Applications
  • Laser Direct Structuring of thermoplastics (LPKF-LDS technology )
  • semi-additive laser technology
  • laser patterning of thermoset and ceramic materials
  • laser ablation of metal layers on different substrate materials
  • laser cutting
  • CO2 snow jet cleaning after laser processing
Laser patterned metal layer on ceramic

Laser patterned metal layer on ceramic

 -Molded Interconnect Devices (MID)
-rewiring device for probe cards
-ischemia sensor device
-micro systems for different branches
TRL RTO
 Contact
7
 Hahn-Schickard, Stuttgart,Germany www.hahn-schickard.de
 Hagen Mueller Hagen.Mueller@Hahn-Schickard.de


Advanced micro assembly
Description Picture
 Current Applications
  • 2D and 3D assembly
  • SMD assembly
  • soldering
  • electrically conductive adhesive
  • chip and wire
  • flip chip technology
  • resistance welding
3D magnetic field sensor

3D magnetic field sensor

 -Molded Interconnect Devices (MID)
-magnetic field sensors
-module for Braille display
-3D sensor carrier
-micro systems for different branches
TRL RTO
 Contact
7
 Hahn-Schickard, Stuttgart,Germany www.hahn-schickard.de
 Dr. Ulrich Kessler
Ulrich.Kessler@Hahn-Schickard.de


Printing
Description Picture
 Current Applications
  • inkjet printing
  • aerosol jet printing
  • pad printing
  • screen printing
  • thermal and photonic curing
Printed intrusion sensor

Printed intrusion sensor

 -temperature sensor for e.g. inserted soles for diabetic
-intrusion sensor
-passive devices (e.g. resistor, capacitor, coil)
-micro systems for different branches
TRL RTO
 Contact
6
 Hahn-Schickard, Stuttgart,Germany www.hahn-schickard.de
 Bernhard Polzinger Bernhard.Polzinger@Hahn-Schickard.de


Additive manufacturing
Description Picture
 Current Applications
3D printing with resolution less than 40 µm (bio compatible resin, ceramic filled resin)
3D printing

3D printing

 -prototyping
-fabrication of individualized products
TRL RTO
 Contact
3
 Hahn-Schickard, Stuttgart,Germany www.hahn-schickard.de
 Bernhard Polzinger Bernhard.Polzinger@Hahn-Schickard.de


Micro injection molding
Description Picture
 Current Applications
  • injection molding of thermoplastic components with tolerances in the micrometer range
  • shot weights of < 1 mg
Microsensor with 50 μm features

Microsensor with 50 μm features

 - microfluidic systems
- microneedles
- microoptical components
TRL RTO
 Contact
7
 Hahn-Schickard, Stuttgart,Germany www.hahn-schickard.de
 Dr. Thomas Günther
Thomas.Guenther@Hahn-Schickard.de


Injection molding of thermosets
Description Picture
 Current Applications
thermosets for improved physical properties (e.g., heat conductivity, high strength)
Packaged PCB

Packaged PCB

 - overmolding of sensitive components like bare dies, LEDs or optical fibers- packaging
TRL RTO
 Contact
6
 Hahn-Schickard, Stuttgart,Germany www.hahn-schickard.de
 Stefan Beichter
Stefan.Beichter@Hahn-Schickard.de


Film-assisted transfer molding  of thermosets
Description Picture
 Current Applications
  • low process pressures for minimum strain of e.g., wire bonds, inserts
  • optical vacancies possible
Packaged image sensors on PCB

Packaged image sensors on PCB

 - packaging of PCBs with optical microelectronic components
- integration of ASICs into standard packages
TRL RTO
 Contact
5
 Hahn-Schickard, Stuttgart,Germany www.hahn-schickard.de
 Daniel Hera
Daniel.Hera@Hahn-Schickard.de


Ultra precision machining
Description Picture
 Current Applications
  • diamond milling of surfaces with 10 nm roughness (Ra)
  • ultra precision milling with dimensional accuracy of 0,5 μm
Milling of lens

Milling of lens

 - high precision tooling
- microoptical components
TRL RTO
 Contact
7
 Hahn-Schickard, Stuttgart,Germany www.hahn-schickard.de
 Dr. Thomas Günther
Thomas.Guenther@Hahn-Schickard.de


Capacitive sensors
Description Picture
 Current Applications
  • application specific design of pressure sensing capacitive membrane
  • microcontroller based readout of sensor
Capacitive sensors

 - pressure, inclination, torque sensors
TRL RTO
 Contact
7
 Hahn-Schickard, Stuttgart,Germany www.hahn-schickard.de
 Adrian Schwenk
Adrian.Schwenk@Hahn-Schickard.de


Inductive Sensors
Description Picture
 Current Applications
application specific design of path and position sensors
Inductive Sensors

 - path and position sensor
TRL RTO
 Contact
6
 Hahn-Schickard, Stuttgart,Germany www.hahn-schickard.de
 André Bülau
Andre.Buelau@Hahn-Schickard.de


Optical Sensors
Description Picture
 Current Applications
development of MID and PCB based miniaturized optical sensors
Optical Sensors

 - rotary encoder
- angle sensor
TRL RTO
 Contact
6
 Hahn-Schickard, Stuttgart,Germany www.hahn-schickard.de
 Dr. Jonathan Seybold
Jonathan.Seybold@Hahn-Schickard.de 


3D magnetic field sensor
Description Picture
 Current Applications
3 axis magnetic field strength sensor based on commercial 1-axis hall sensors
3D magnetic field sensor2

 - suitable as a SMD component
TRL RTO
 Contact
6
 Hahn-Schickard, Stuttgart,Germany www.hahn-schickard.de
 Dr. Ulrich Kessler
Ulrich.Kessler@Hahn-Schickard.de


3D distance sensor
Description Picture
 Current Applications
MID based with commercial 1-axis proximity sensor
3D distance sensor

 - presence detection
- prevention of collision
- distance sensor
- proximity sensor
TRL RTO
 Contact
6
 Hahn-Schickard, Stuttgart,Germany www.hahn-schickard.de
 Dr. Ulrich Kessler
Ulrich.Kessler@Hahn-Schickard.de


Pumping technology
Description Picture
 Current Applications
  • electromagnetic driving unit
  • contamination free
Pumping technology

 - medical engineering
- biotechnology
TRL RTO
 Contact
6
 Hahn-Schickard, Stuttgart,Germany www.hahn-schickard.de
 André Bülau
Andre.Buelau@Hahn-Schickard.de


FEM simulation
Description Picture
 Current Applications
  • Thermo-mech. simulation
  • Injection molding simulation --Lifetime prediction
  • Electromagnetic simulation
  • Coupled analysis
  • Design of experiments
Analysis of SMD on MID

Analysis of SMD on MID

 - Lifetime prediction models for soldered SMD on MID
- Thermal management of LED on MID
- Material models for thermoplastics
TRL RTO
 Contact
8
 Hahn-Schickard, Stuttgart,Germany www.hahn-schickard.de
 Tobias Grözinger
Tobias.Groezinger@Hahn-Schickard.de 


Piezoelectric fibre sensor
Description Picture
 Current Applications
Melt spun bi component fibres with 25µm core. Piezo and pyroelectric properties
Piezoelectric fibre sensor

 Breathing, heart beat, movement
TRL RTO
 Contact
3-4
 Swerea IVF Mölndal, Sweden (www.swereaivf.se)
 Dr Erik Nilsson, erik.nilsson@swerea.se


Additive manufacturing
Description Picture
 Current Applications
3D printing with resolution less than  40 µm (ceramic slurry, metal powder) or less than 25 µm (SLA for polymers)
Additive manufacturing

 prototyping and low volume production
TRL RTO
 Contact
3-4
 Swerea IVF Mölndal, Sweden (www.swereaivf.se)
 Thorbjörn Åklint thorbjorn.aklint@swerea.se 


CO2 sensitive layer
Description Picture
 Current Applications
Mesoporous layer filled with colored reagents that change of absorption spectrum with CO2 concentration up to A4 sheet format on plastic substrate
CO2 sensitive layer

 prototyping and low volume production
TRL RTO
 Contact
4-5
 CSEM SA, Neuchâtel, Switzerland (www.csem.ch)
 Guy Voirin
guy.voirin@csem.ch 

Silicon nitride 400 nm thick membrane with submicron pores (400 - 800 nm)
Description Picture
 Current Applications
Microfabricated silicon nitride membrane, membrane thickness 400 nm, pore size down to 400 nm
Si3N4 membrane

 prototyping and small series production
TRL RTO
 Contact
5-6
 CSEM SA, Neuchâtel, Switzerland (www.csem.ch) Guy Voirin
guy.voirin@csem.ch

 TRL: Technology Readiness Level
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